5/8/22 Bennett To Serve As Moraine Park Commencement Alumni Welcome Speaker
8 May 2022 News
Fond du Lac, Wisc.: Moraine Park Technical College has announced Cory Bennett, of Beaver Dam, as the Alumni Welcome Speaker for the 2022 Commencement Ceremony on Saturday, May 21, at the Fond du Lac High School.
Bennett came to Moraine Park in 2010, looking for personal and professional growth.
“I’ve always succeeded in school but didn’t consider continuing my education right after high school,” Bennett said. “I found success in my employment, but eventually, I wanted more for myself.”
He enrolled in the mechanical design technology program at Moraine Park and became involved with on-campus clubs such as the student senate and Phi Theta Kappa, a 2-year college high honors program. He was also a part of the National Community College Aerospace Scholarship Program, an elite group of students who participated in research, space rover robotics design, and mock missions.
Bennett found employment before he graduated in 2014 and quickly grew in his career. In 2016, he returned to the College to pursue an associate degree in electromechanical technology. Bennett graduated for the second time in 2020 and has returned to the College multiple times for certificate and general continuing education courses.
“In eight short years, I moved from an entry-level designer to an engineering manager, and now onto managing the daily business operations,” Bennett said. “I went from barely being able to manage myself to managing 100 employees. Moraine Park helped get me there.”
As a two-time Moraine Park graduate, Bennett’s hard work and dedication are exceptional examples of the potential of all MPTC alumni. Bennett works at Centro, Inc. in Beaver Dam as a Business Process Leader.
Nearly 800 graduate candidates will be receiving Associate of Applied Science degrees and technical diplomas, with over 350 graduate candidates expected to participate in the Commencement Ceremony. Bonnie Baerwald, Moraine Park president, will preside over the ceremony.
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